Aluminum Metallization Paste

Create an efficient & cost-effective Back surface field (BSF) with Targray's Al Paste

Targray offers a cost-competitive, customizable Aluminum paste that produces an improved back surface field on Si solar cells.

Attain higher cell efficiencies, improved production yields and lower material consumption in low bow, high electrical performance aluminum metallization applications.

Features

• Targray’s Al pastes are formulated for low bow applications with tolerances below 1.5 mm.
• Available with Terpineol solvent or Butyl Carbitol solvent to conform to your process requirements.
• Controlled glass frit uniformity (vertical integration of glass frit supply).
• Co-firable with front side grid and back side bus bars.
• Excellent printing and handling properties.
• High adhesion and abrasion resistance.
• Cost Competitive.

Customized AL paste solutions

Targray offers a variety of standard formulations or tailor-made Al paste solutions for optimal concordance with your needs. Consult one of our expert PV materials engineers for help identifying the best Al BSF paste for your application.

Our state-of-the-art Al powder technology allows fine-tuning of the size, shape and distribution of aluminum particulate for a paste solution specific to your process requirements.