Silver Metallization Paste

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Ag Paste (Silver Metallization Paste)

For front and back bus contact

Heraeus

Better yields and higher outputs for solar cell manufacturers.

In partnership with Heraeus, Targray offers the HeraSol Ag paste compositions.

These silver metallization pastes are customizable to your process, thus increasing efficiency and fill factor while providing wider processing windows.

The HeraSol compositions are a series of screen-printable front and back side silver conductors for crystalline solar cells. The front side formulation is ideal for lightly-doped emitter designs and optimized for high throughput processing to deliver excellent aspect ratios and fine line resolution. For back side solder applications, the new lead-free silver paste significantly lowers material consumption due to high coverage and excellent initial and soldered age adhesion.

Benefits

  • HeraSol Ag metallization pastes are all very high quality and uniformly consistent from batch to batch.
  • Customizable to your unique wafer design and processes.
  • All formulations cadmium-free. Lead-free pastes also available.
  • Formulations suitable for SiNx or TiOx anti-reflective coatings are available.
  • Co-fireable with commercial back side Ag/Al pastes.

Customized Ag Paste Solutions

Targray offers a variety of standard formulations or customized Ag paste solutions for your specific requirements. Heraeus’ state-of-the-art paste manufacturing technology allows fine-tuning of the size, shape and distribution of particles for optimum paste performance.  All of our Heraeus Silver metallization pastes are specially formulated to provide higher efficiencies and wider processing windows, resulting in better yields and higher output for cell manufacturers.

Metallization Pastes for Conventional c-Si Solar Cells
Pastes SOL952 SOL953 SOL9235H(L) SOL9273M SOL9318 SOL230(x)***
Description Front-side Ag conductive paste Front-side Ag conductive paste for high sheet resistance emitter Front-side Ag conductive paste Front-side Ag conductive paste Pb-Free front side Ag conductive paste Back-side Ag paste for solderable busbar application
Sheet resistance applicable ≤ 70 ohms/sq ≤ 80 ohms/sq,
shallow emitter
≤ 70 ohms/sq ≤ 80 ohms/sq, shallow emitter < 70 ohms/sq  
Glass frits Cd free Cd free Cd free Cd free Cd free, Pb free Cd free, Pb free
Viscosity* 180 – 240 kcps 180 – 240 kcps 320 – 360 kcps (280 – 320 kcps) 330 – 370 kcps 300 – 350 kcps 100 – 160 kcps
Solids content 84.0 ± 1% 84.5 ± 1% 89.5 ± 1% 89.5 ± 1% 89.0 ± 1% 71.5 ± 1%
Solderability Sn62 / Pb36 / Ag2 or Sn96.5 / Ag3.0 / Cu0.5
Wafer types monocrystalline and multicrystalline silicon
Wafer surface treatment Textured Textured Textured Textured Textured Textured/planar
Anti-reflection coating SiNx:H SiNx:H SiNx:H SiNx:H SiNx:H  
Print screen 280 – 325 mesh S/S screen
Screen emulsion thickness 15 – 25 µm 20 – 25 µm 20 – 25 µm 20 – 25 µm 20 – 25 µm 10 – 15 µm
Drying 150 °C for 10 minutes in circulated air oven or 250 - 300 °C for 20 seconds in belt dryer
Firing IR belt furnace, Spike Fire
Peak firing temperature**
(not setpoint temperature)
740 – 800 °C 740 – 800 °C 740 – 800 °C 740 – 800 °C 740 – 800 °C 725 – 825 °C
Printed thickness (after fired) 15 – 20 µm 15 – 25 µm 20 – 30 µm 20 – 30 µm 15 – 25 µm 5 – 12 µm
Thinner RV – 354 RV – 507
Shelf lifetime 6 months
Storage 5 – 25 °C  - Do not refrigerate
Usage Allow paste to come to room temperature prior to opening - Spatulate well before using
*Brookfield HBT, SC4-14 Spindle in 6R Utility Cup @ 10 rpm
**Peak firing temperature measured with type-K, 20 gauge thermocouple on surface of wafer. Omega #KMQXL-020G-18
***SOL230(x): (M)-North America, (H)-Europe, (S)-Asia, (T)-Pb containing
 

 

Metallization Pastes for Novel Cell Designs
Pastes CL80-9381M CL80-9383M SOL108
Description Conductive Ag paste for use as second layer in double print process
(print / dry - print / dry)
Conductive Ag paste doped with Al for n-type wafer with p+ surface Low activity Ag for through hole printing (MWT – cells)
Viscosity* 320 – 360 kcps 280 – 320 kcps 17 – 22 Pas at 100 s-1, 25°C,
Plate / cone
Solids content 87.5 ± 1% 85.5 ± 1% 87.5 ± 1%
Wafer types Mono and multi n-type Mono and multi
Print screen 280 – 325 mesh S/S screen 280 – 325 mesh S/S screen 230 – 250 mesh S/S screen,
30 µm wire
Screen emulsion thickness 15 – 20 µm 20 – 25 µm 10 – 15 µm (2 ~ 5 µm)**
Printed thickness (after fired) 15 – 20 µm 15 – 20 µm wafer thickness
Print line resolution (finger width) ≥ 50 µm ≥ 80 µm 50 – 100 µm diameter vias
Thinner RV – 354 RV – 354  
Shelf lifetime 6 Months
*Brookfield HBT, SC4-14 Spindle in 6R Utility Cup @ 10 rpm
**Printing with pad

Please ask us about our latest generation of paste for high sheet resistance wafers – SOL9273. Capture an increased efficiency with this cutting edge Ag paste.

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